Investigation of Temperature Distribution in SIC Power Module Prototype in Transient Conditions

New power module prototypes are being designed to take advantage of the high operating temperature and high power density benefits of using SiC chips. Thus, monitoring the temperature distribution in the power module is critical. This work investigates the temperature distribution in a power module using Infrared Thermography in steadystate and transient test conditions. The methodology, results and observations from the tests are discussed in this work.