TSV-IaS: Analytic Analysis and Low-Cost Non-Preemptive on-Line Detection and Correction Method for TSV Defects

Through-Silicon-Via (TSV) is one of the most promising technologies to realize 3D Integrated Circuits (3D-ICs); however, the reliability issues due to the low yield rates and the sensitivity to thermal hotspots and stress issues are threating TSV-based 3D-ICs. On the other hand, real-time applications demand short response time to the new occurrence faults which make online testing become a critical challenge. In order to solve this problem, this paper presents an online method named TSV-IaS which supports detecting and correcting open and short defect TSVs by isolating and shifting the signals of TSVs then analyzing the output syndromes. Furthermore, we also present an analytical analysis on detectability and response time of the proposal. Results show that with R redundant TSVs in a group, the proposed method can fully correct R defects and detect R+1 defects while keeping a low-cost structure. Monte-Carlo simulations also demonstrate a 100% detection rate with 32-cycles based tests.