On the Design of An Improved Model of Additively Manufactured Microstrip Transmission Lines for Radio Frequency Applications

The additive manufacturing (AM) process is gaining massive popularity among engineers and researchers. Due to the ever increasing demands of communication speed and bandwidth for catering versatile applications, radio frequency circuits are becoming more complex leading to higher manufacturing costs. One technique to address such challenges to use AM technology for fabricating next generation radio frequency circuits with very high precision. However, materials with far lower melting points than conventional metals are a necessity for currently available AM techniques. This paper investigates the possibilty of incorporating an improved version of an industrially available conductive material to design high frequency circuits for applications from 100 MHz up to 5 GHz. Measurement data and verification result using full-wave simulation is presented.