Improved techniques for the measurement and modeling of plastic surface mount packages to 20 GHz

General technique is presented for modeling and characterization of RFIC plastic packages from DC to 20 GHz, and is applied to an industry standard SSOP-8. An improved Thru-Reflect-Line (TRL) measurement method suited for package modeling is presented the modeling approach includes the use of measured data, finite element method (FEM) electromagnetic modeling of the package, and a new circuit synthesis technique to obtain an accurate equivalent circuit. Excellent agreement is obtained to 20 GHz between modeled and measured results, demonstrating the utility of the technique.