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Active Interposer Technology for Chiplet-Based Advanced 3D System Architectures

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Perceval Coudrain; J. Charbonnier; A. Garnier; P. Vivet; Rémi Vélard; A. Vinci
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Abstract:

We report the first successful technology integration of chiplets on an active silicon interposer, fully processed, packaged and tested. Benefits of chiplet-based archite...Show More

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Abstract:

We report the first successful technology integration of chiplets on an active silicon interposer, fully processed, packaged and tested. Benefits of chiplet-based architectures are discussed. Built up technology is presented and focused on 3D interconnects process and characterization. 3D packaging is presented up to the successful structural test and characterization of the demonstrator.
Published in: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
Date of Conference: 28-31 May 2019
Date Added to IEEE Xplore: 26 August 2019
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DOI: 10.1109/ECTC.2019.00092
Conference Location: Las Vegas, NV, USA
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