Application of Fan-Out Panel Level Packaging Techniques for Flexible Hybrid Electronics Systems

Flexible Hybrid Electronics (FHE) is in the limelight for next generation electronics, it has good potential for further development as the priority areas for focused study, not only can it create new products, but also meet the needs of flexible, bendable, and stretchable characteristics. Furthermore, FHE brings new business opportunities to the semiconductor industry, and it has niche growth potential in the fields of healthcare, aviation, soft robotics and Internet of Things (IoT). Fan-out panel-level packaging (FOPLP) technology have the advantages of thinner packaging, good heat dissipation and high electrical performance. In this paper, the RDL-first FOPLP techniques is adopted to develop the FHE systems with ITRI's core technologies, i.e., FlexUPTM and mechanical de-bonding. With ITRI's FlexUPTM and flexible display technology, the related problems can be overcame such as broken circuit and poor electrical performance, which were caused by bending and stretching the circuit of the RDL substrate. The results showed that ITRI's core technology could meet the demand of FHE systems. It also provide a solution to solve the contradiction between the characteristics of the rigid structure and flexible requirements.