A Zero Height Small Size Low Cost RF Interconnect Substrate Technology For RF Front Ends For M.2 Modules And SiP

a small size Radio Frequency Interconnect Substrate (RFIS) front end with 'zero height' and low cost has been designed for dual-band Wi-Fi filter solutions. In the conventional Wi-Fi front end solutions, discrete components are used, which are placed as other additional components externally to the System in Package (SiP) (or silicon) on the 1216 board. Conversely, in this new "zero height, low cost solution", the RFIS is placed in the SiP (System in Package) along with the Silicon. Since the RFIS can be integrated into the SiP, the device performance will be better in terms of linearity and power consumption. Also, it makes the manufacturing and assembly cost much lower, as it adds 'zero height' to the design and saves a lot of space on the board.