Advances in Temporary Carrier Technology for High-Density Fan-Out Device Build-up

As the need for higher degrees of function integration on chips continues to rise, chip-to-chip connection density exponentially increases. The continuous push for denser interconnects has brought conventional FO-WLP to its limit. A novel FO-WLP concept has been proposed to enable 20-μm pitch interconnect chip-to-chip. To achieve this density and to further scale it down, a critical element is ultra-precise die-to-die positioning in the micron range. Advances in temporary bonding materials and carrier systems are required to enable such applications.