Highly Reliable Piezoelectric Process Technology in Volume Foundry for Emerging Mems Applications

This work presents the piezoelectric process technology developed in a high volume foundry for emerging MEMS applications. Innovative reliability enhancement techniques for piezoelectric devices are demonstrated to significantly boost (1) dielectric breakdown voltage from 30V to 110V, (2) time-dependent-dielectric-breakdown lifetime by 100X, (3) temperature-humidity-bias stress robustness (0% failure achieved), and (4) PZT imprint and fatigue controllability (99% recovery from imprint achieved) to fulfill stringent reliability and piezoelectric performance stability criteria for emerging MEMS applications in Internet of Things (IoT) era.