A Mems-Based Microstructure Surface Providing Suspension Platforms to Bubbles for Efficient Boiling Heat Transfe

An improved microstructure surface for efficient chip cooling by enhancing bubble dynamics was designed, fabricated and tested. The improved microstructure, two layers of crossing strip Cu arrays, was numerically proved to form suspension platforms that become extra surfaces for bubbles' coalescence and departure. Experimental results show that at superheat of 20°C, heat flux dissipated by this microstructure surface was 4 times of that on smooth surface and heat transfer coefficient reached 50,000 W/(m
²
K), delaying the formation of gas blanket. The micro structure made by low-cost manufacture route compatible with regular IC manufacture provides potential for chip cooling enhancement in industrial applications.