Submicrometer-Scale All-Soft Electronics Based on Liquid Metal

This paper presents a novel fabrication technique to create submicrometer-scale liquid metal (eutectic gallium-indium alloy, EGaIn) thin-film patterns for all-soft electronic devices. The proposed hybrid lithography process combines electron-beam lithography with soft lithography and enables high resolution and high density all-soft electronic passive components and microelectrode arrays. For the first time, submicrometer-scale EGaIn thin film patterning with feature sizes as small as 375 nm is demonstrated. Thanks to the intrinsic softness of EGaIn, the fabricated devices can endure mechanical strain >30%, while maintaining electrical functionality.