Package Design Methodology for Crosstalk Mitigation between DC/DC Converter and ADC Analog Inputs in Complex SoC

Going beyond the traditional approach used in package design based on layout guidelines, in this paper a chip-package co-design methodology is developed to optimize the final design. Optimization is achieved thanks to the identification of the main coupling mechanisms and pointing out their exact location at package-level. Measurements carried out on a laminate ball grid array (BGA) proved the effectiveness of this methodology to identify and optimize the most severe crosstalk (mainly due to inductive coupling) between the gate drivers of the DC-DC converter and ADC analog inputs in a microcontroller for automotive applications.