Modular Carrier Board and Package for Infrared LED Arrays

Infrared scene projectors (IRSPs) are a critical laboratory tool for setup, calibration, and testing of infrared sensors. Infrared light emitting diode projectors are evolving to handle higher resolution, faster frame rates, and higher cooling power. New cryogenic packaging that can support these advanced features is needed. This paper describes a new cryogenic package design that enables higher resolutions and faster frame rates. The resulting modifications to the IRSP system hardware are described.