A Novel Integrated Multi-Layer Cooling (IMLC) Structure for High Power Density Applications

This paper proposes a new Integrated Multi-Layer Cooling (IMLC) thermomechanical structure for high power density applications. The IMLC structure includes three design objectives to maximize thermal performance while optimizing power density. First, multiple PCBs are stacked vertically to increase PCB surface area. Second, cold plate liquid cooling is integrated onto the bottom most PCB to increase heat transfer. Third, components are distributed based on heat generation to efficiently cool lossy components. PCB thermal resistances are estimated based on three dimensional orthogonal thermal conductivities. FEA based thermal simulation is conducted with single PCB design and two-layer IMLC design. A 1.3kW power converter prototype is constructed with a single-layer PCB design using integrated liquid cooling. In testing, efficiency is improved by 0.6% and high loss component temperature rise is decreased by 50% compared to an air-cooled design. A two-layer IMLC design achieves the same thermal performance while improving power density by 31%.