Effective Mask Patterning Strategy as Design Complexity and CD Stability

Design for manufacturing (DFM) is one of the solutions to avoid patterning issues and the resulted yield loss. It is dependent on process capability and manufacturability. As design rule and feature size shrinks, exposure conditions and OPC treatment are more complicated placing more dependence on accurate mask fabrication. This paper studies mask patterning issues in leading edge technology impacted by mask design and complexity. Mask pattern fidelity, CD uniformity, impact on wafer process, and adaptable solutions for yield loss/pattern issues are discussed here. In addition, we will mention mask friendly design and/or OPC, impacts on mask and wafer process based on mask fabrication capability and process of record (POR) for high-end mask technology.