Advanced Semiconductor Packaging Materials – Copper with Bamboo Structure

Semiconductor chips are the most advanced devices in microelectronics. Chips today and tomorrow look for copper with improved electrical, thermal and mechanical properties. In this study, we report a new copper structure with a large grain size and a strong preferred orientation. It exhibits lower electrical resistance, better mechanical and thermal stability. We investigated properties of this copper in relation to its grain size, distribution of the orientation, micromorphology, etching rate, surface roughness, and its mechanical behavior under thermal excursion. More detailed results will be presented in due course.