Study on Infrared Spectrum Detection and Analysis of BTA Residual after Copper CMP

During Cu CMP process BTA is widely used as a corrosion inhibitor, reacts with Cu and forms a strong hydrophobic Cu(II)-BTA complex, which causes severe device problems. Thus, it is very essential to clean and detect the BTA residue on the Cu surface after CMP. In this paper, the characteristic peaks of BTA powder, Cu(II)-BTA complex and Cu surface contaminated with BTA before and after cleaning with FA/O II chelating agent were examined by Fourier transform infrared spectroscopy. The results demonstrated that the infrared spectroscopy method was accurate and reliable for the determination of BTA residues, and the FA/O II chelating agent can effectively remove the BTA.