APEC Talks Reliability and Production of WBG Devices: Disclosing the Latest Developments in Components, Packaging, Transportation Electrification, and Renewable Energy

From the plenary talks to the industry sessions to the exhibit floor, reliability and production of wide-bandgap (WBG) devices were the buzzwords at this year's 34th IEEE Applied Power Electronics Conference and Exposition (APEC), which was held on 17-21 March at the Anaheim Convention Center in California. Besides presenting reliability data and highlighting the production status of gallium nitride (GaN) and silicon carbide (SiC) power devices, this premier conference in applied power electronics also presented seminars and papers on the latest advances in silicon and WBG devices, packaging, controller integrated circuits (ICs) and topologies, passive components (see the "Passive Components" column in this issue of IEEE Power Electronics Magazine, p. 12), renewable energy, transportation electrification, and more.