Ultrathin 3D FO‐WLP eWLB‐PoP (Embedded Wafer‐Level Ball Grid Array‐Package‐on‐Package) Technology

Embedded Wafer‐Level Ball grid array (BGA) (eWLB) technology uses a combination of front‐ and back‐end manufacturing techniques with parallel processing of all the chips on a wafer, which can reduce manufacturing costs. eWLB‐Mold Laser Package‐on‐Package (MLP) technology is a new combination of fan‐out wafer‐level packaging (FO‐WLP) and molded laser package‐on‐package (PoP), which is used in conventional flip‐chip substrate packaging. The continued demand for a higher level of integration has led to the industry's adoption of 3D packaging technologies and, in particular, the PoP configurations. This technology allows for vertical integration of the memory package and the logic package into one stacked package. The requirement for system‐in‐packages (SiP) integration is also a growing trend for advanced application processors, MEMS, and sensors in internet‐of‐things (IoT) and wearable electronics (WE) as way to cost‐effectively achieve advanced silicon die partitioning for increased performance and integration in a reduced form factor.