Migration of flow inducted hotspot with heat spreader integrated microchannel subjected to asymmetric heat flux: A Multiphysics approach

The heat spreader integrated microchannel heat sink is employed in thermal management of transient hotspot problem in multicore processors for high density electronic cooling application. The heat transfer characteristics of heat spreader integrated microchannel were comprehensively analyzed experimentally and numerically, and their effectiveness and thermal enhancement factor was compared with the regular microchannel. By using deionized water and Graphene oxide (GO) nanofluid as working fluid, investigations were conducted for Reynolds number ranging from 100–300. Multiple hotspot cores were modelled in the microchannel with four different heat fluxes to study the temperature responses in the heat spreader under transient thermal loads. Additionally, studies were conducted to address the thermal stress developed in the packaging of heat spreader integrated microchannel in multiple hotspot conditions. The result shows that the thermal effectiveness of GO-0.12% increased 65% as compared with pure fluid.