Design Methodology of DC Power Cycling Test Setup for SiC MOSFETs

The long-term reliability concerns regarding the latest power devices, e.g., silicon carbide (SiC) MOSFETs, need to be well understood for their rapid and widespread deployment in industrial applications. As an effective reliability assessment, the dc power cycling test is one of the most realistic procedures providing accelerated lifetime tests. In this paper, a dc power cycling setup for SiC power MOSFETs is proposed, and the design methodology is generalized for practicing engineers. At first, the aging-independent junction temperature measurement method is identified to eliminate the laborious recalibration process. Specifically, the electrical parameter changes of commercial SiC MOSFETs are evaluated in a power cycling test. It is observed experimentally that the body diode's voltage drop at low current and negative gate bias is unaffected by the device/package degradation. Therefore, it is selected for T
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measurement in the proposed setup. Following that, the design considerations regarding precise parameter measurement of the device's parameter are presented. The transient behavior of the proposed test setup is analyzed, and a simulation model is built in LTspice. Based on the model, the effects of gate timing control and paralleled capacitors are investigated for realizing accurate measurements, and the simulation results are verified experimentally in a prototype. In addition, considering the measurement delay in the conditioning circuits and the common-mode noise, the practical issues affecting the measurement accuracy in a multiple-phase setup are investigated in the experiment. Experimental results show that an accurate measurement can be achieved with the design considerations.