A 25-Gbps × 4 ch, Low-Power Compact Wire-Bond-Free 3D-Stacked Transmitter Module with 1.3-μm LD-Array-on-Si for On-Board Optics

A 4-channel wire-bond-free 3D-stacked transmitter module consisting of a 65-nm CMOS cascode shunt LD driver, 1.3-μm LD-array-on-Si, and LTCC interposer achieves simultaneous 4-channel 25-Gbps error-free transmission over 1.2-km-long SSMF, with power consumption of 2.67 mW/Gbps.