Effects of Resin Binder on Characteristics of Sintered Aluminum–Copper Nanopaste as High-Temperature Die-Attach Material

This paper aims to report an aluminum-copper (Al-Cu) die-attach system as a Pb-free alternative for electronic applications. The Al-Cu die-attach system is formulated by a mixture of Al and Cu nanoparticles and a constituent of organic compounds and sintered at 380 °C ± 10 °C without any pressure application. The effects of organic additives on physical, structural, and electrical properties are investigated to understand the die-attach quality of Al-Cu nanopaste. The formation of CuAl2 phase is discovered, which confirmed the joining of Al and Cu nanoparticles in sintered nanopaste layer. Solid-state fusion of Al and Cu can be seen in scanning electron microscope (SEM) analysis. Energy dispersive X-ray (EDX) analysis demonstrates sample of 0.25-g V006A has the lowest oxygen element at 15.36%. Sample with 0.25-g organic additives exhibits the smallest crystallite size and electrical resistivity, which were 8.15 nm and 21 μΩ · cm, which is favorable for high-temperature applications.