Identifying the Loss Components Contributing to the Series Resistance of Shielded On-Chip Coplanar Waveguide Interconnects

In this paper, it is provided a full characterization analysis of the losses contributing to the series resistance of ground-shielded coplanar waveguide interconnects. For this purpose, the loss components associated with the signal trace, the ground path, the shield, and radiation are separately determined by processing experimental data and electromagnetic simulations. This also allowed for the identification of the impact of the skin effect on the losses occurring within the ground shield. Experimental curves corresponding to lines exhibiting different shields are represented up to 30 GHz using the proposal. Furthermore, different resistive components are obtained as a function of the trace width and spacing to figure out the effect of geometry on the series resistance. In addition, a time domain analysis is included to assess the impact of neglecting each one of the resistive components on the quality of a multigigabit-per-second digital signal.