Abstract:
Thru-Silicon designs and manufacturing process flows are introduced as a means to produce 3D wafer level packaging solutions. Standard silicon IC manufacturing unit-proce...Show MoreMetadata
Abstract:
Thru-Silicon designs and manufacturing process flows are introduced as a means to produce 3D wafer level packaging solutions. Standard silicon IC manufacturing unit-processes must be combined into robust process-flows to allow for the rapid deployment of wafer-level packaging throughout the industry.
Published in: Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507)
Date of Conference: 06-08 August 2000
Date Added to IEEE Xplore: 06 August 2002
Print ISBN:0-930815-59-9
