Research on Reliability of Quartz Resonator for Solder Cracking Issue Based on Finite Element Method

As the most widely used frequency component, quartz resonator is seriously affected by the phenomenon of solder crack during actual use in hot and cold impact environment. For the phenomenon of solder crack, firstly, analyzed by the finite element software, the stress, creep and failure period distribution of solder are obtained. According to the results of simulation and combined with the theory of stress singularity, the structure of resonator package is improved. Through the finite element analysis of the improved structure and comparison with the original structure, it can be concluded that the structure is feasible in delaying solder crack. Finally, by comparing the two structures through experiments, it can be further concluded that the improved structure has a certain inhibitory effect on solder crack in practical applications.