Designing of Microstrip Patch Antenna by Using via Hole for Bandwidth Enhancement in C and X Band Application

This paper presented the microstrip patch antenna with a shorting pin and U slot in a ground plan for C and X band application. The proposed design is simulated by using FR4 substrate and IE3D software. The design is suitable for Wi-Max and WLAN frequency band. The substrate is used for reducing the dielectric losses and improving the performance of proposed design. The U shape are used in a ground plan and the via hole of radius 0.15mm is connected in between ground plan and exciting patch on a FR4 substrate. The proposed design is used for 10 Ghz. . For this geometry we achieved Bandwidth 58 % for VSWR<2, minimum return loss= - 19 dB, and maximum directivity 6 dBi. The Bandwidth of proposed antenna for WLAN communication and X band is investigated.