Effect of Material Properties and Bump Parameters on Capillary Filling in Through-Silicon-Via Underfill Dispensing

A through-silicon-via (TSV) underfill dispensing method was introduced in previous studies to fill the under-chip space of a 2. 5D die/interpose package. A jet dispensing valve was used to dispense free droplets of an underfill fluid into a central TSV. The TSV functioned as an inlet for fluid flow and a fluid reservoir to uninterruptedly supply the underfill fluid. In an underfill process, the time required for completely filling the under-chip space is so-called “filling time As the underfill fluid commonly flows very slow, shortening the filling time in underfill process is substantial to reduce overall processing time. This study analyzes the fluid flow behavior in the under-chip space and investigates the effect of material properties and bump parameters on filling time.