Laser hybrid integration on silicon photonic integrated circuits with reflected grating

For high-density, broadband, and low power consumption interconnect, the flip-chip silicon photonic integrated circuits (PIC) is a promising package structure which makes the signal path shorter, and reduces losses and power. A back injecting reflected grating which makes light couple from backside of the PIC is designed and simulated. A laser diode (LD) hybrid integration scheme on a silicon PIC is design and simulated. The simulated efficiency of LD coupling into the waveguide through reflected grating is 42.55%. The light output from the proposed grating to fiber is also designed and simulated. The coupling efficiency is 38.02%, the coupling loss is 4. 2dB.