Development of Half-inch FOWLP Process Line utilizing Minimal Fab

The authors developed Fan-Out Wafer-Level Package (FOWLP) process line with half-inch wafer utilizing Minimal Fab. It was the first time in the world that can manufactures an analog chip FOWLP prototype. In addition, as an evaluation of the package, the results of the solder ball shear strength and the four terminal resistance measurements were acceptable.