Inhibitation of substrate heating in a Minimal Multi-Target Helicon sputtering tool

A minimal multi-target helicon sputtering tool has been developed for depositing a multi-layer metallic film in Minimal Fab System. In sputtering processes, high energy charged particles and recoil neutrals often flow into the substrate, resulting in an increase in a substrate temperature. Here the substrate temperature is investigated in a laboratory prototype of the minimal multi-target sputtering tool. Our experiment shows that the increase in the temperature can be successfully inhibited by installing a magnetic filter. This result implies that the increase in the substrate temperature is induced by secondary electrons from the target surface.