3DVLSI, Technology and Application

System integration takes benefit from 3D stacking technologies in a wide range of applications such as imagers, stacked memories, mobile applications and high-performance computing. Several integration schemes are considered worldwide to address applications specific requirements: performance, cost, form-factor, thermal management or even supply chain availability. Nevertheless, most of the available technologies cannot offer ultra-fine pitch interconnect, below 10μm. This paper presents two 3D-high density (with 3D interconnects pitch around or below the μm range) schemes using on one side direct hybrid bonding and on the other one monolithic integration. Both integrations are described and current status are given. A technology/application roadmap is proposed positioning both integrations and showing that they offer complementary approaches to tackle most of today challenges in terms of cost, area, power and performance.