Evaluation of Heat Dissipation Performance of Printed Circuit Board Using JPCA Method in CFD Analysis

In recent years, heat generation from electronics components is increasing and heat dissipation thorough printed circuit board (PCB) is becoming important. Though there are several measurement methods of thermal conductivity of PCB materials, measured thermal conductivity is dependent on the methods and it is difficult to judge heat dissipation performance only from the catalog values. Therefore, a standard of evaluation of heat dissipation performance is required. Japan Electronics Packaging and Circuit Association (JPCA) proposed an evaluation method of heat dissipation performance of PCB. For thermal design of electronics, out-of-plane and in-plane heat dissipation performance of PCB materials are important. In JPCA method, heat dissipation performance in both directions can be evaluated. In this paper, we set several thermal conductivities to PCB in computational fluid dynamics (CFD) analysis, and evaluate heat dissipation performance of PCB using JPCA method.