Loading [MathJax]/extensions/TeX/ietmacros.js
A Flexible, Heterogeneously Integrated Wireless Powered System for Bio-Implantable Applications using Fan-Out Wafer-Level Packaging | IEEE Conference Publication | IEEE Xplore
Subscribe
ADVANCED SEARCH
Conferences >2018 IEEE International Elect...

A Flexible, Heterogeneously Integrated Wireless Powered System for Bio-Implantable Applications using Fan-Out Wafer-Level Packaging

PDF
G. Ezhilarasu; A. Hanna; R. Irwin; A. Alam; S. S. Iyer
All Authors

Abstract:

Fan-Out Wafer-Level Packaging (FOWLP) is used to fabricate a near field wireless implantable system on an ultra-flexible (~5mm bending radius) & biocompatible elastomeric...Show More

Metadata

Abstract:

Fan-Out Wafer-Level Packaging (FOWLP) is used to fabricate a near field wireless implantable system on an ultra-flexible (~5mm bending radius) & biocompatible elastomeric substrate. A μLED is powered wirelessly with an efficiency > 15% @ 1cm transmit distance. The implantable system is only ~ 535μm thick with a diameter <;2cm.
Published in: 2018 IEEE International Electron Devices Meeting (IEDM)
Date of Conference: 01-05 December 2018
Date Added to IEEE Xplore: 17 January 2019
ISBN Information:

ISSN Information:

DOI: 10.1109/IEDM.2018.8614705
Conference Location: San Francisco, CA, USA
Contents
Contact IEEE to Subscribe

References

References is not available for this document.

IEEE Account

Purchase Details

Profile Information

Need Help?

A not-for-profit organization, IEEE is the world's largest technical professional organization dedicated to advancing technology for the benefit of humanity.
© Copyright 2025 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.