Novel Electronic Packaging Method for Functional Electronic Textiles

A novel packaging method that enables the reliable mounting and protection of bare die within a textile yarn has been investigated. The reliability of electronic textiles is highly challenging given the flexibility of the fabric and the rigors of typical applications. Achieving reliable operation requires novel packaging approaches. In order to maximize the reliability and to minimize stresses in the electronic package, the die should be located as close as possible to the central axis of the overall assembly. The die is bonded to a bottom Kapton substrate that contains patterned conductive interconnects and bond pads forming the functional circuit. The circuit is protected by a molded Kapton film that has recesses formed where the die is located. This approach has been compared with three other traditional packaging technologies during washing, twisting, and cyclical bending tests. The novel electronic packaging method shows the best performance in all tests surviving up to 45 wash cycles.