Numerical Study with Experimental Validation of Thermal Coupling Phenomena with Flip-Chip Assembled Test Dies on PCB

In current electronic systems, different active and passive components have placed in short distances and increase the power density of the substrates. Thermal convective and conductive interactions of components should be considered during the early layout design process. Furthermore, numerical simulation of the fluid flow mechanics can help, to analyse coupling effects between heat sources and the surrounding environment. Computational Fluid Dynamics (CFD) simulations are often time consuming, expensive and need a lot of knowledge to handle parameters, boundary conditions, fluid models and their received results. First rough analytic estimations, which describes the coupling phenomena, can help to understand conductive heat spreading along the substrate, or convective thermal boundary layer conditions at laminar or turbulent fluid flows.