Thermal Modeling and Experimental Validation of Heat Sink Design for Passive Cooling of BEOL IC Structures

Reducing the operating temperature of microelectronic devices is crucial for increasing reliability and extending lifetime. This study presents a proposed embedded heat sink design for passive cooling of BEOL interconnects and IC structures. Sample devices are fabricated and tested using thermoreflectance thermography to characterize the thermal response of the devices and assess the added cooling effects of the heat structures. An experimentally validated thermal model is built to analyse the thermal performance of the device and extract the thermal parameters of the structure.