Temperature distribution measurement for chips based on FPGA

In this paper, a novel temperature distribution measurement method based on the field-programmable gate array (FPGA) embedded ring oscillators is proposed. Ring oscillators, as smart thermal sensors, are mainly based on the relationship between the delay time and the temperature. An infrared image of the chip is captured using an infrared camera to verify the correctness of the proposed method. The measured temperature error varies by less than 2.1°C.