A Compact RF Front-End SiP Using Silicon-Based Integrated Passive Devices

This paper presents a compact RF front-end SiP (System in Package) using silicon-based integrated passive device (IPD). Several IPDs and active chips are integrated in the SiP as a full system module. The IPDs are designed on the silicon substrate and as a chip carrier for the active chips. The active chips are assembled on the substrate by using the flip-chip technology. SiP packaging type is the ball gird array (BGA) and the dimension is 14.5×6.8×0.8mm3 that is much smaller than using traditional integration technique. The results satisfy our design that concluding the silicon-based IPD technology is a good choice for RF module and can be easily used for transmitter&receiver applications.