Global 3-D Modeling Study for a MMIC PA

In order to accurately analyze interconnect reliability for IC, the 3-D modeling is the inevitable approach. Taking a MMIC PA as an example, three methods for 3-D modeling based on ANSYS are evaluated in this paper. Comparing with these methods, the manual drawing method is suitable for the simple models. But when the model is complex, the parametric modeling method based on ADPL is more convenient for model revision. If the model is more complex, which is difficult to construct using APDL, the layout transformation method is the best choice. All these studies can give important guidance for the IC modeling.