A high power density and high efficiency three phase inverter based on a hybrid 3D SiC packaging power module

This paper presents the design of a high power density and high efficiency three phase inverter based on a highly integrated 3D SiC packaging power module. Due to the low inductive of the packaging power module, the power module can operate on fast switching speed safely, which will realize a high efficiency. The 3D power module integrating with gate drivers, DC-link, cooling fan and heat-sink increases space utilization to realize a high power density. For a better thermal performance, the diameter and distribution of holes in the heat-sink has been optimized by the simulation. The simulation results show that the 36 holes heat-sink with diameter 5 mm has the best thermal performance, and the 3D heat-sink achieves 37.5% volume reduction and realizes uniform temperature distribution compared with the traditional heat-sink design. Moreover, a 5 kW single phase half-bridge inverter prototype is built to demonstrate the validity of the heat-sink design. Based on the analysis of the simulation and the test, a 20 kW three phase inverter prototype with 18.6 kW/L power density and 99% efficiency can be realized.