Back End Monolithic Serial Interconnection Technology for CIGS with Shunt-free Laser Scribing and Inkjet Printing

Back end interconnection technology is presented for CIGS using laser scribing and inkjet printing of dielectric material. Shunt-free laser scribing of CIGS is shown, which is essential in the back end approach for monolithic serial interconnection. Full back end interconnected mini-modules of 20×20cm
²
were made and show no electrical losses compared to the reference cells. These results show the feasibility of complete module manufacturing after full area deposition of the CIGS stack, enabling cheaper and more flexible production of PV modules.