Degradation Studies Including Light-Induced Degradation of c-Si Solar Cells with Nickel-Copper Plated Contacts

The reliability and degradation of copper contacts is a topic of concern as copper is considered as an alternative to screenprinted silver. In this work, we perform reliability testing of modules of crystalline silicon (c-Si) solar cells with nickel-copper (Ni-Cu) plated contacts, including both traditional fullarea back surface field (BSF) and local-area passivated and rear emitter (PERC) cells. In particular, we have demonstrated two separate manners in which Cu-plated cells show greater susceptibility to degradation than analogous Ag-screenprinted cells. We expose modules to environmental stress using climate chambers, and light soak modules under natural sunlight. In both circumstances we have demonstrated separate modes in which Cu-plated cells show greater susceptibility to degradation than analogous Ag-screenprinted cells.