Materials Development and Increased Module Efficiency for 15% Cost Reduction of Back Contact Modules

Foil-based back contact module interconnection technology (FBC) is a versatile solution for high-performance all back contact modules. We exploit the advantages of FBC to make full size modules replacing Cu with lower cost Al. Characterization shows that these modules have excellent electrical performance and reliability. The pick and place module technology, allows us to also make a module using thin (95 μm) cells with high yield on FBC industrial equipment. Electroluminescence spectroscopy shows minimal microcracking. To increase performance, the high conductivity of FBC modules is used to make an MWT module with more than 6% increased short circuit current by using the space between cells with minimal loss in fill factor. Taken together these innovations offer more than 15% cost reduction for back contact modules. These improvements demonstrate the potential for FBC technology for applications that demand reduced materials, costs, weight, and maximum performance for high-efficiency cells.