New Flip-Chip Bonder Dedicated To Direct Bonding For Production Environment

3D vertical integration of components is today an industrial reality. To reduce pitch of interconnection between the dice, the hydrid bonding technique, offering sub-10μm interconnection pitch, is widely demonstrated for Wafer-to-Wafer bonding. Die-to-Wafer direct bonding remains today more challenging due to additional particle contamination and handling complexity but presents interesting assets.The purpose of this paper is to demonstrate the performance of a fully automated Die-to-Wafer bonder, SET FC1, specifically designed for direct bonding dedicated to production. After a description of the process and the elements developed specially for this process, it will be demonstrated that an accuracy of ± 1 μm can be reached today with a throughput up to several hundred dice per hour. If progresses still need to be done, the particle contamination is low enough to enable demonstration of oxide/oxide Die-to-Wafer direct bonding. Considering the results obtained until now, industrialization appears feasible.