LTCC-like Multilayer LCP-Technology for flexible RF-Circuits

The paper addresses a new manufacturing technology of multilayer printed circuit boards made of Liquid Crystal Polymer (LCP) which offers superior dielectric loss behavior (tan δ from 0.002 to 0.004 at frequencies up to 100 GHz). Similar to processes known from the production of multilayer ceramics (e.g. LTCC or HTCC) only additive structuring technologies such as stencil or screen printing are applied to create vias and conductor traces. In contrast to standard multilayer PCB-technology the layer stack is established in a single lamination step instead of a sequential build up procedure.