Bare Die Connections via Aerosol Jet Technology for Millimeter Wave Applications | IEEE Conference Publication | IEEE Xplore

Bare Die Connections via Aerosol Jet Technology for Millimeter Wave Applications


Abstract:

This paper presents a comparison of chip connections using Aerosol Jet (AJ) and bond technology on low cost PCB substrates. First, the behavior of the used gap filler mat...Show More

Abstract:

This paper presents a comparison of chip connections using Aerosol Jet (AJ) and bond technology on low cost PCB substrates. First, the behavior of the used gap filler material and the used silver ink on printed circuit boards are characterized. In addition to comparing the RF performance (DC to 67 GHz) of the two technologies, the mechanical stability is also compared. While the AJ technology transitions score above all for their RF performance and the lower requirements (surface finish, pad size and adhesion) on the PCB, the bonding technology has clear advantages, especially with different coefficient of thermal expansion (CTE) values of the substrates to be connected. Finally, the measurement results of a complete package are shown, whereby the chip connection is realized once by means of aerosol jet and once by bonding wires.
Date of Conference: 23-27 September 2018
Date Added to IEEE Xplore: 22 November 2018
ISBN Information:
Conference Location: Madrid, Spain

References

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