Broadband Full-Wave BIE Impedance Characterization of 3-D Interconnects

In this paper, a full-wave boundary integral equation formulation is proposed that accurately characterizes 3-D interconnects. By extending a recently presented framework for the resistance and inductance calculation that employs a 3-D differential surface admittance operator, the total impedance is computed. The inclusion of capacitive effects is validated and demonstrated over a broad frequency range.