Low cost packaging techniques for active waveguide devices

Recent developments in WDM systems have created an increased demand for low cost active waveguide devices (modulators, electro-optic switches etc). Standard packaging for these devices includes individual alignment and hermetic sealing in order to meet both the performance and Bellcore type reliability requirements. Passive optical devices have been demonstrated using lower cost packaging techniques, however when applied to active waveguide devices these packaging approaches can compromise both reliability and performance criteria. In this paper packaging techniques for Lithium Niobate active waveguide devices, for example analogue modulators, digital modulators and Electro-optic switches, are outlined. These techniques enable the cost of the packaging to be significantly reduced while still maintaining the performance and reliability of the traditional hermetic packaging approaches. In particular the paper outlines the packaging of a 2.4 Gbit Lithium Niobate modulator with integrated optical attenuator for use in WDM systems. The packaging techniques however can also be used on other active waveguide devices and examples of electro-optic attenuators, 2/spl times/2 and 1/spl times/8 electro optic switches are shown. The packaging techniques demonstrated show wafer scale alignment, plastic packaging and encapsulation of a Flip chip bonded device's with single or multiple fibre connections. Reliability and performance data is compared to the standard type hermetic metal packages demonstrating the suitability of the new packaging technique for active optical waveguide components.