Experimental and computational study of array effects on LED thermal management on molded interconnect devices MID

Due to the functional integration potential and the excellent design freedom, molded interconnect devices (MID) are becoming more and more attractive for several fields, such as consumer electronics, automotive and lighting technologies. In this context, the need for better reliability, especially for the solid state lighting, has significantly increased recently. Thermal management impacts not only the efficiency but also the reliability and the color stability of LED arrays, where LEDs are subjected to mutual interferences. Thus, the use of highly filled and thermally conductive thermoplastics appears very appealing.In light of this fact, an experimental and computational study, with focus on the influence of the substrate material and heat dissipation concepts on the thermal management of low- and high-power LEDs on MID, is presented in this paper. The accuracy of the implemented Finite Elements Analysis (FEA) is also examined in this work and used to forecast the reliability of a 3D-MID lighting module.